The Plasmalab 800 Plus
The Plasmalab 800 Plus is a plasma processing system, which can be configured to carry out Reactive Ion Etching (RIE), Plasma Enhanced Chemical Vapour Deposition (PECVD) or Plasma Etching.
It is a large capacity open loaded system with a 380mm or 460mm diameter electrode, which offers a capacity of up to x12 4” wafers or up to x 21 3” wafers. The substrate table (lower electrode) is made of aluminium for temperatures up to 400ºC and stainless steel where temperatures may reach 700ºC. Water cooling is provided for the tables where Reactive Ion Etching/Plasma etching processes are used, and for the top electrode and the table legs in the PECVD application. It is ideally suited for batch PECVD processing where excellent across chamber uniformity of less than 2% is achieved for silicon nitride and silicon dioxide layers.