We recognise that our customers may be worried about the impact of COVID-19 and our ability to continue to provide services to partners. Read about our response.

Muhlbauer TTS300 Thermode

This is used to thermode bond a SMD component to a printed circuit by applying pressure and temperature to the top and bottom of the components

This is used to thermode bond a SMD component to a printed circuit by applying pressure (0.29N10.83N) and curing temperature (~160) to the top and bottom of the component(s) and printed substrate. This is to create an electrical connection between the SMD component and printed circuit using conductive adhesives like ACP245.