Muehlbauer roll to roll multi-component integration line
The Muehlbauer roll to roll multi-component integration line comprises of flip chip wafer handling married to standard SMT component placement.
This combination is ideal to meet the needs of flexible electronics across multiple markets from LED flexible walls to IoT enabled labels.
The line is fitted with multiple dispensing and curing technologies to meet the needs of the most demanding products.
The ability to attach flexible components including batteries in high volumes gives designers the ability to turn an intricate design into reality.
Inline functional testing of electrical circuits is carried out via contact pins or noncontact antenna.