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CIF FT05 Reflow Oven

A reflow oven to reflow and cure solder

This can work with the new high temperature alloys. For a best precision, the heat is distributed by forced convection. The reflow oven FT05 includes the memorisation of 10 programmes, with a microprocessor temperature control up to 300°C, working area of 350400mm, and the ability to set a precise reflow time.