CIF FT05 Reflow Oven
A reflow oven to reflow and cure solder
This can work with the new high temperature alloys. For a best precision, the heat is distributed by forced convection. The reflow oven FT05 includes the memorisation of 10 programmes, with a microprocessor temperature control up to 300°C, working area of 350 x 400mm, and the ability to set a precise reflow time.