Event Highlights Smart Packaging Potential

11 Oct 2018

The Centre for Process Innovation (CPI) hosted experts from the smart packaging industry to highlight its work on next-generation printable electronics.

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Welcoming guests from a number of companies and organisations, the event showcased CPI’s high speed roll-to-roll integration and conversion capabilities, which enable the pilot production of functional tags for smart labelling in packaging and wearable goods.

The open day focused upon a number of projects overseen by CPI, including ReMedieES (RE-configuring MEDicines End-to-end Supply), which, alongside GlaxoSmithKline and AstraZeneca, saw CPI develop and scale up smart packaging concepts using printed electronics.

With smart packaging carrying great potential for many industries, thanks to its ability to provide real-time data on temperature, humidity, shock, tampering and counterfeiting of goods — REMEDIES examined how it could re-shape the multi-billion pound global medicine manufacture and supply sector.

Delegates were told of CPI’s work on product trials within REMEDIES, notably how condition and quality data was transferred to GlaxoSmithKline via the Internet of Things, as well as its development of superior barrier material for blister packaging.

Additionally, the open event saw presentations from TNO/​Holst about the opportunities presented by the InSCOPE project, which supplies a pilot line service to advance the accuracy and reliability of hybrid printable electronics.

InSCOPE supports large organisations, newcomers and SMEs in transforming flexible electronics technologies into novel products.

Event guests also had the opportunity to see first-hand CPI’s capability across this emerging technology through a tour its newest printable electronics facility.

Based in Newton Aycliffe, County Durham, the centre builds upon existing facilities at NETPark, in Sedgefield, also County Durham, combining world-class equipment with technical expertise. Its unique offering includes the delivery of an end-to-end process, from design to prototype and scale-up.

It also allows for the integration of sensor and electronic Internet of Things-connected inlays on a variety of flexible substrates to create reels inlays at high volume, and features a converting line to integrate inlays into smart labels and tags at high volume.

Tim Marsden, Project Manager at CPI, said: The event brought together experts behind the successful projects, which are designed to create change in the smart packaging industry. It also allowed them to network with like-minded people in the research, technology innovation and manufacturing of printed, flexible and large-area electronics.”

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