Challenges for Flexible Interconnect and Encapsulation

Event Details

Start Date
Thu, 23 Nov 2017 09:30
End Date
Thu, 23 Nov 2017 16:00
CPI's National Printable Electronics Centre
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Reliable interconnection of electronic components and new substrate forms using novel joining materials are critical for the rapid commercialisation of new electronic systems. With new product innovations being developed for Medical Diagnostics, Smart packaging and the Internet of Things (IoT), understanding these materials and their associated manufacturing methods is critical to successful innovation.

Recent advances in emerging and enabling technologies, requires the introduction of new low temperatures materials, which are robust yet flexible and are amenable to high volume digital manufacturing. The UK has a good record of innovation in this field and the High Value Manufacturing (HVM) Catapult is pleased to support UK capability building and commercial expertise.

The MTC and CPI are currently exploring the development of new forms of interconnection and joining to support UK industry and the future of digital electronic manufacturing. As part of the project, this workshop will highlight recent advances and also seek to identify key areas where new national capability is required.

The event will be a seminar held at CPI’s National Printable Electronics Centre in Sedgefield, near Durham City with a combination of academic research, materials and equipment manufacturers. To discuss industries requirements, challenges, opportunities including collaborative RnD, networking and supply chain building.

The workshop event will present the latest industry developments and UK & EU collaborative R&D project outputs in flexible integrated circuit production and nanomaterials including sintering. Views and opinions will be collated into a synthesis document and made available to those that attend.

An atmosphere of collaboration is encouraged at the event between all parties to foster longer term interactions.


9:30 — Registration, Refreshments and Exhibition

10:00 — Welcome, Introduction and Housekeeping

Adele Pilscott, MTC James Johnstone, CPI

10:10 — Welcome

John Cocker, CPI

10:20 — Session 1

Keynote and Company Case Studies

11:30 — Coffee Break and Pastries

12:00 — Session 2

Academic and HVM Catapult Presentations

12:30 — Lunch, HVM Catapult Exhibition and Networking

14:30 — SESSION 3

Pitches and Business Development

15:30 — Closing Reports, Comments and Farewells