Challenges for Flexible Interconnect and Encapsulation
Reliable interconnection of electronic components and new substrate forms using novel joining materials are critical for the rapid commercialisation of new electronic systems. With new product innovations being developed for Medical Diagnostics, Smart packaging and the Internet of Things (IoT), understanding these materials and their associated manufacturing methods is critical to successful innovation.
Recent advances in emerging and enabling technologies, requires the introduction of new low temperatures materials, which are robust yet flexible and are amenable to high volume digital manufacturing. The UK has a good record of innovation in this field and the High Value Manufacturing (HVM) Catapult is pleased to support UK capability building and commercial expertise.
The MTC and CPI are currently exploring the development of new forms of interconnection and joining to support UK industry and the future of digital electronic manufacturing. As part of the project, this workshop will highlight recent advances and also seek to identify key areas where new national capability is required.
The event will be a seminar held at CPI’s National Printable Electronics Centre in Sedgefield, near Durham City with a combination of academic research, materials and equipment manufacturers. To discuss industries requirements, challenges, opportunities including collaborative RnD, networking and supply chain building.
The workshop event will present the latest industry developments and UK & EU collaborative R&D project outputs in flexible integrated circuit production and nanomaterials including sintering. Views and opinions will be collated into a synthesis document and made available to those that attend.
An atmosphere of collaboration is encouraged at the event between all parties to foster longer term interactions.
9:30 — Registration, Refreshments and Exhibition
10:00 — Welcome, Introduction and Housekeeping
Adele Pilscott, MTC James Johnstone, CPI
10:10 — Welcome
John Cocker, CPI
10:20 — Session 1
Keynote and Company Case Studies
11:30 — Coffee Break and Pastries
12:00 — Session 2
Academic and HVM Catapult Presentations
12:30 — Lunch, HVM Catapult Exhibition and Networking
14:30 — SESSION 3
Pitches and Business Development