PETEC
...The Printable Electronics Technology Centre
Our services / Prototyping and Fabrication
PETEC’s core competency is the fabrication of prototype devices or subsystems using novel printable materials onto flexible substrates.
PETEC houses a wide range of fabrication tools that allow the development of thin film devices such as OTFT, SSL, OPV. The equipment set is a mixture of conventional and novel process tools. This allows fabrication routes to be developed which are similar enough to existing manufacturing, such that new materials can be easily transferred to pilot lines, but can also show the potential benefits when new printing technologies are used. In addition to the equipment sets, PETEC's scientists are a vital component of developing new device processes. They have been recruited with extensive experience in the areas of organic materials development, TFT-LCD backplane fabrication, high-yield device manufacture and novel flexible display development.
PETEC's capability roadmap starts with working on R2R flex for deposition (sputtering) and laminated foils on rigid carriers for patterning. The rigid panel approach to prototyping permits devices to be fabricated at a relatively low cost during the early stages of development. The later stages of the roadmap are to develop continuous wet coating and printing, with the final challenge of R2R patterning and registration enabling the lowest cost device production process to be realised.